CTQTableCharacteristicsProcess/ProductParameterSolder pastetypeStoreEnvironmentSolder PasteThicknessSolderpasteprintaccuracyScraper SizeSpecificationAlpha OM340Temperature 0~10℃110~180um1. <30%2. +/-50um12 InchMethodInstrument/Tooling----Control Method/FrequencyWi RecordProcessStageSolderPasteSolderPastePrintingRefrigerator1 time/ dayStore/ThermometerThickness2 Panels/hrsMeasureLSM1. 2Panels/hrs2. 1time/yearSize measureAutomatic-MPMaccelaAutomatic-MPMaccelaAutomatic-MPMaccelaAutomatic-MPMaccelaManually (Dirtfree paper+IPA,air gun blow)Initial SetUpMachine ParameterMachine ParameterFront/Rear55 ± 10 (mm/sec)ScraperSpeedFront/Rear5.5 ± 1 (kgs)ScraperPressureTrans. Speed200-250 (mm/sec)Down StopDistance12.5± 0.2 (mm)Machine ParameterMachine ParameterLine stop more than 30 minutesStencil CleanCleaning, no dirtyAutomatic stencilAfter every changover finishedcleaning machineStencil CleanVacuum/Wet/DryMode (Auto)Clean Speed50± 10(mm/sec)Clean CycleStencilThickness1time/panel0.12mmAutomatic-MPMaccelaAutomatic-MPMaccelaAutomatic-MPMaccelaTension reportMachine ParameterMachine ParameterMachine ParameterStencil tension check recordProcess Capability(CPK/MSA)--------CPK≥1.33Xbar-R control chartCPK>1.33--------------------------------------------
