专利内容由知识产权出版社提供
专利名称：COPPER PLATING BATH COMPOSITION
AND METHOD FOR DEPOSITION OFCOPPER
发明人：Dirk ROHDE,Jens PALM申请号：US15754008申请日：20160909
公开号：US20180237932A1公开日：20180823
专利附图：
摘要：The present invention relates to aqueous acidic plating baths for copperdeposition in the manufacture of printed circuit boards, IC substrates, semiconducting
and glass devices for electronic applications. The plating bath according to the presentinvention comprises at least one source of copper ions, at least one acid and an additiveobtainable by a reaction of at least one aminoglycidyl compound comprising at least oneamino group which bears at least one glycidyl moiety and at least one second compoundselected from ammonia and amine compounds wherein the amine compounds compriseat least one primary or secondary amino group with the proviso that the aminoglycidylcompound contains at least one polyoxyalkylene residue and/or the amine compoundcontains at least one polyoxyalkylene residue. The plating bath is particularly useful forfilling recessed structures with copper and build-up of pillar bump structures.
申请人：Atotech Deutschland GmbH
地址：Berlin DE
国籍：DE
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