专利内容由知识产权出版社提供
专利名称：Method for forming encapsulated IC
packages
发明人：Gerald K. Fehr申请号：US08/424151申请日：19950417公开号：US05682673A公开日：19971104
摘要：A mold is provided for use in encapsulating integrated circuit (IC) dies attachedto die attach pads of lead frames, wherein the mold has one or more support elements incavities of the mold for supporting the die attach pad portions of the lead frame whilethe mold is closed on the lead frame and encapsulation material is injected toencapsulate the IC dies and die attach pads. The support elements are, in a preferredembodiment, pins extending from the surfaces of the cavities in the mold, and the pinskeep the die attach pads from moving into contact with surfaces of the cavities, so dieattach pads or dies are not exposed in finished packages. In a preferred embodiment thepins each are tapered in the extended portion, so the amount of exposure of the dieattach pad is absolutely minimized. In another embodiment, the support elements areretractable. In still other embodiments, support elements are beads bonded to a leadframe strip or dimples provided to a lead frame strip in the process of manufacturing thestrip. Methods for practicing the invention are provided as well.
申请人：IPAC, INC.
代理人：Donald R. Boys
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