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专利名称：Package encapsulant compositions for use in
electronic devices
发明人：Bodan Ma,Quinn K. Tong申请号：US094540申请日：20010628
公开号：US20010056162A1公开日：20011227
摘要：A curable composition for encapsulating an electronic component comprisesone or more mono- or polyfunctional maleimide compounds, or one or more mono- orpolyfunctional vinyl compounds other than maleimide compounds, or a combination ofmaleimide and vinyl compounds, with a free radical curing agent, and optionally, one ormore fillers.
申请人：MA BODAN,TONG QUINN K.
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