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专利名称：Package encapsulant compositions for use in
electronic devices
发明人：Ma, Bodan,Tong, Quinn K.申请号：EP99112725.9申请日：19990701公开号：EP0969063A3公开日：20000223
摘要：A curable composition for encapsulating an electronic component comprisesone or more mono- or polyfunctional maleimide compounds, or one or more mono- orpolyfunctional vinyl compounds other than maleimide compounds, or a combination ofmaleimide and vinyl compounds, with a free radical curing agent, and optionally, one ormore fillers.
申请人：National Starch and Chemical Investment Holding Corporation
地址：P.O. Box 7663 Wilmington, Delaware 19803-7663 US
国籍：US
代理机构：Held, Stephan, Dr.rer.nat., Dipl.-Chem.
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