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专利名称：Process for assembling and resin-encapsulating a semiconductor power devicemounted on a heat sink
发明人：Casati, Paolo,Cognetti de Martiis,
Carlo,Marchisi, Giuseppe
申请号：EP91830471.8申请日：19911030公开号：EP0484297A2公开日：19920506
专利附图：
摘要：A die-stamped frame (2) is fastened to a heat sink metal baseplate (1) by
wedging flexible tabs (3,4) into receiving indentations (5,6) of the baseplate (1) whilekeeping the frame (2) substantially in contact with the surface of the baseplate (1). Thewire welding operations may then take place on the end of the fingers (2b) of thepatterned metal frame (2) while the same are solidly resting on the surface of thebaseplate (1) thus facilitating the welding. The backing-off of the metal frame (2) fromthe surface of the heat sink baseplate (1) takes place upon the closing of the mold (9,11)used for encapsulating in resin the device. The injection of the resin and its solidification\"freezes\" the pins (2b) in the backed-off position imposed by the mold (9,11) uponclosing, thus ensuring the electrical isolation between the pins (2b) and the integral heatsink baseplate (1).
申请人：SGS-THOMSON MICROELECTRONICS S.r.l.
地址：Via C. Olivetti, 2 I-20041 Agrate Brianza (Milano) IT
国籍：IT
代理机构：Pellegri, Alberto
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