专利内容由知识产权出版社提供
专利名称：CHEMICAL MECHANICAL POLISHING
PLATFORM ARCHITECTURE
发明人：JAGAN RANGARAJAN,Alpay Yilmaz申请号：US13293088申请日：20111109
公开号：US20130115862A1公开日：20130509
专利附图：
摘要：Embodiments of the invention provide polishing systems for increasingproduction efficiency, maximizing substrate throughput, and reducing production costs.The polishing systems generally include one or more polishing stations for performing a
CMP process and one or more cleaning stations at which post-polishing cleaning isperformed. The number of cleaning stations and polishing heads present may beincreased depending on the desired substrate throughput or processing time at eachpolishing station. The number of polishing stations or cleaning stations can also bereduced in order to reduce the footprint of the polishing system. The polishing pads ateach polishing station can be adjusted in size to accommodate one or more polishingheads simultaneously depending on substrate throughput and system footprint.Additionally, the polishing pads may be replaced with a fixed abrasive pad, or adapted topolish 450 millimeter substrates.
申请人：JAGAN RANGARAJAN,Alpay Yilmaz
地址：Fremont CA US,San Jose CA US
国籍：US,US
更多信息请下载全文后查看
