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专利名称：Lead frame for semiconductor package and
method of manufacturing the same
发明人：Sang-hun Lee,Se-chuel Park申请号：US11202052申请日：20050811
公开号：US20060237824A1公开日：20061026
专利附图：
摘要：A lead frame for a semiconductor package and a manufacturing method thereofare provided. In the lead frame, a Ni plating layer made of Ni or a Ni alloy is plated on abase metallic layer. A Ni—Pd plating layer made of a Ni—Pd based alloy and having a Ni
atomic concentration in a range of about 60% to about 95% is plated on the Ni platinglayer, and a protective plating layer is plated on the Ni—Pd plating layer.
申请人：Sang-hun Lee,Se-chuel Park
地址：Changwon-si KR,Changwon-si KR
国籍：KR,KR
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